Sporre, John., Ruzic, David N.,, Stubbins, James F.,, Eden, James G.,Miley, George H.. () Diagnosis of the flux emanating from the intermediate focus of an extreme ultraviolet light lithography source.MLA Citation
Sporre, John., Ruzic, David N.,, Stubbins, James F.,, Eden, James G.,Miley, George H.,Diagnosis Of The Flux Emanating From The Intermediate Focus Of An Extreme Ultraviolet Light Lithography Source. : . Print.
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Diagnosis of the flux emanating from the intermediate focus of an extreme ultraviolet light lithography source.
|Main Author:||Sporre, John.|
|Other Names:||Ruzic, David N., | Stubbins, James F., | Eden, James G., | Miley, George H.,|
|Vernacular:||This is largely affected by the chamber pressure (peak flux was observed at 6 mTorr with an arrival time of ~700 μs), buffer gas mass (40 AMU had the highest measured flux with an arrival time of ~800 μs), and pinch gas species (40 AMU pinch gas mass had the highest energy deposition into 40 AMU buffer gas, though arrival time was the same for all species. Furthermore, deposition rates at the intermediate focus were shown to peak at 2 mTorr with a rate of 1.5±0.3x10-4 nm/pulse and a total film concentration of oxygen and carbon totaling greater than 90%. Increasing pressure reduces deposition rate because of increased buffer gas suppression of depositing metals from the electrode, as well as increased etching by the higher density generated plasmas. Increase buffer gas was theoretically shown to decrease the deposition rate at the intermediate focus, though Sn and Cu particulates increased with increasing buffer gas mass due to arcing between the electrodes and resulting sputtering. Ultimately the understanding of the importance in choosing buffer gas mass, pinch gas mass, and chamber pressure are emphasized in regards to the transport of debris from the EUV emitting plasma to the intermediate focus.
|Published:||Urbana, Ill.: University of Illinois at Urbana-Champaign; 2013.|
|Topics:||Theses - UIUC - 2013 - Nuclear, Plasma, & Rad Engr.|
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