Location & Availability for: Chip scale package (CSP) : design, mater

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Chip scale package (CSP) : design, materials, processes, reliability, and applications /

John H. Lau, Shi-Wei Ricky Lee.

Book Cover
Main Author: Lau, John H.
Other Names: Lee, Shi-Wei Ricky.
Published: New York : McGraw-Hill, c1999.
Series: Electronic packaging and interconnection series
Topics: Integrated circuits - Design and construction. | Microelectronic packaging.
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University of Illinois at Urbana-Champaign

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Location & Availability for: Chip scale package (CSP) : design, mater