Lau, John H.Lee, Shi-Wei Ricky. (1999) Chip scale package (CSP) :design, materials, processes, reliability, and applications New York : McGraw-Hill,MLA Citation
Lau, John H.Lee, Shi-Wei Ricky.Chip Scale Package (CSP): Design, Materials, Processes, Reliability, And Applications. New York : McGraw-Hill, 1999. Print.
These citations may not conform precisely to your selected citation style. Please use this display as a guideline and modify as needed.
Chip scale package (CSP) : design, materials, processes, reliability, and applications /
John H. Lau, Shi-Wei Ricky Lee.
|Main Author:||Lau, John H.|
|Other Names:||Lee, Shi-Wei Ricky.|
|Published:||New York : McGraw-Hill, c1999.|
Electronic packaging and interconnection series
|Topics:||Integrated circuits - Design and construction. | Microelectronic packaging.|